Fuses integrate power switches, digital controllers, current sensing, and all of the other smarts for hot swapping in a ...

Discover Olo Inc.'s robust Q1 2025 performance with 21% revenue growth, new partnerships like Chipotle, and strategic initiatives in Catering Plus & Olo Pay.

Intel's new roadmap; EU chip plan needs work; RISC-V boost; UK IC workforce study; materials and wafer shipments; on-chip PDN ...

Hardware-Software Co-Optimization for End-to-End Communication in Multi-Chip-Modules” was published by researchers at Georgia ...

But, even as we face these challenges, many companies continue to innovate in ways that surprise and delight us. It’s time to ...

The iPhone 18 could get a performance gain from memory, with Apple rumored to be using a new faster memory option in the 2026 ...

In this paper, we report the design and multi- FPGA chip implementation of a 64-node butterfly network based on MPSOC. Our Network is placed and routed automatically on the 4 FPGA included in Eve Zebu ...

Nowadays, the usage of Intellectual Property cores has been an alternative to the increasing gap between design productivity and chip complexity of System-on ... these cores are produced in a multi ...

Cerence AI, in collaboration with MediaTek and NVIDIA, has unveiled an advanced multi-modal language model ... the company introduced the MCPF1412 power module, offering greater efficiency ...

State Key Lab of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China Center of Materials Science and ...

TSMC is prepping a 9.5-reticle, 7,885 mm² multi-chiplet packages on 120×150 mm substrates with integrated power management for future AI and HPC processors.