As India accelerates its semiconductor ambitions, the spotlight is on billion-dollar commitments from giants like Tata ...

Taiwan's ASE Technology Holdings and US-based Amkor Technology maintain their positions atop the global outsourced ...

TSM plans to construct nine new advanced wafer and packaging factories by 2025 to meet growing demand for its chips, with a ...

CT Semiconductor has begun the second phase of its chip packaging and testing plant in Vietnam, targeting 100 million chips ...

President Donald Trump's focus on tariffs revealed that supply chains are vulnerable in some places and that some production needs to be brought back to the U.S. One key area is semiconductors, as ...

We warmly invite you to visit us and explore how our advanced technologies can help shape the future of semiconductor packaging.

E&R will be co-exhibiting at the booth of our valued partner Scientech. We warmly invite you to visit us and explore how our advanced technologies can help shape the future of semiconductor packaging.

Researchers from Massachusetts Institute of Technology (MIT) and HRL Laboratories developed a specialized chip to test and validate cooling solutions for packaged chip stacks. The chip dissipates ...

Supply chain and hardware security vulnerabilities affect all industries, but they pose additional risks for the defense sector. Over-manufacturing and re-manufacturing allow chips from friendly ...

In-depth examination of these technologies, such as high-bandwidth memory (HBM) from memory providers (e.g., Samsung, SK Hynix, and Micron Technology) and advanced semiconductor 2.5D and 3D packaging, ...

Fujifilm Corp. (Tokyo) has signed a Memorandum of Understanding (MOU) with Tata Electronics Ltd. (Mumbai, India) for partnership to establish semiconductor material production and supply chain in ...