Special report on die-to-die interconnect standards; chiplet development flows; AI accelerators move out from data centers; optimizing analog; UALink; power intent; HBM4.

Chiplets will be a key enabler for customizing designs at every level, from edge devices to the cloud. AI is a key driver, ...

They depend on careful coordination between RTL, verification and implementation teams. And here’s where things get tricky. Without a consis­tent way to describe and validate power intent across the ...

Two standards — Bunch of Wires (BoW) and UCIe — compete with proprietary designs. Today, the latter predominates, since ...

Chiplets offer a huge leap in semiconductor functionality and productivity, just like soft IP did 40 years ago, but a lot has ...

Structural and Thermal Aware Methodology for Placement in 2.5D Integration” was published by researchers at Pennsylvania ...