Different from Chip on Wafer stacking technology, Wafer on Wafer (WoW) stacking can provide a tighter pitch and higher interconnect density with higher through-put. The difficulty for WoW stacking is ...

Dense 3D face correspondence is a fundamental and challenging issue in the literature of 3D face analysis. Correspondence between two 3D faces can be viewed as a non-rigid registration problem that ...

It is noted that in July 2021, the 75-year-old Richards was hit by a drunken car driver while he was riding a bicycle. As a result, the Briton suffered serious injuries to his face and ribs. The man ...

Inside this remarkable Singapore 3D-printed concrete house The two-year project emerged through collaboration with local 3D concrete printing specialist CES_InnovFab and arrived at a pivotal moment ...