Explore how SiC and GaN are redefining power-supply design to meet the growing demands of AI SoCs. Large language models ...

Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.

The ASIL-D certification applies to the full range of SEMPER NOR products, including QSPI, HyperBus, and JEDEC xSPI octal interfaces; 256-Mb to 2-Gb densities; and BGA, WSON, and SOIC packages. To ...