Synopsys 3DIO is architected to support 2.5D, 3D and SoIC package form factors, with flexible physical dimensions on u-BUMP or TSV integration. It comprises a portfolio of 3DIO IP products enabling ...

Synopsys 3DIO is architected to support 2.5D, 3D and SoIC package form factors, with flexible physical dimensions on u-BUMP or TSV integration. It comprises a portfolio of 3DIO IP products enabling ...

We got a hold of some DS3232 RTC chips in a 20-pin SOIC package. We’d like to have one that is breadboard compatible for easy prototyping but when we searched for SOIC20W breakout board artwork ...