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Tom's Hardware on MSN3D X-DRAM aims for 10x capacity of today's memory — NEO Semiconductor's memory has up to 512 Gb per moduleNEO Semiconductor has announced progress on its new 3D X-DRAM technology, with new 1T1C and 3T0C chip designs increasing DRAM ...
A team of Harvard researchers have unveiled a way to map the molecular underpinnings of how learning and memories are formed, ...
How do memories last a lifetime when the molecules that form them turn over within days, weeks or months? An interaction ...
NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the ...
Merging neurons with semiconductors signals a shift in brain–machine interface design and neuromorphic engineering.
Nordic’s position in the semiconductor supply chain is weak. Foundries might prioritize larger players such as automobile companies, which use similar manufacturing technologies as Nordic. Nordic has ...
Intel's new roadmap; EU chip plan needs work; RISC-V boost; UK IC workforce study; materials and wafer shipments; on-chip PDN ...
Ji-Seon Kim talks about the transformative potential of carbon-based semiconductors and the benefits of tangible experiences ...
Solving Computing’s Memory Problem” was published by researchers at ETH Zurich. Abstract “Computing has a huge memory problem ...
In these semiconductors, that polarity can flip under an electric field—and stay that way even after the field is gone.
Semiconductors are the fundamental building blocks of almost all modern electronics, powering everything from smartphones and ...
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