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Infineon and Stellantis partner on power architectures. Power grids supplied by renewables have lower intensity blackouts. Nexperia to partner with KOSTAL on automotive WBG devices. US lab wins $1M grant to boost SiC module voltages. Infineon unveils world's thinnest silicon power wafer. 'All-GO-HEMT' to develop β-gallium oxide heterostructures.
News - Power Electronics World
Oct 31, 2024 · You may choose to subscribe to the Power Electronics World Magazine, the Power Electronics World Newsletter, or both. You may also request additional information if required, before submitting your application.
News - Power Electronics World
Nov 7, 2024 · You may choose to subscribe to the Power Electronics World Magazine, the Power Electronics World Newsletter, or both. You may also request additional information if required, before submitting your application.
Littelfuse unveils Ultra Junction X4-Class 200V MOSFETs
2 days ago · Littelfuse has introduces its X4-Class 200V Power MOSFETs, including the IXTN400N20X4 and IXTN500N20X4, with what it claims is a breakthrough in low on-state resistance. “The new devices will allow designers to replace multiple low-current rated devices, connected in parallel, with a single device solution,” said Sachin Shridhar Paradkar ...
Power electronics: facing rapid capacity expansion - News
Sep 12, 2024 · According to Yole's 'Status of the Power Electronic Industry, 2024' report, the power electronics market will reach $35.7 billion by 2029, growing at a CAGR of 7 percent from 2023, when it was $23.8 billion. The power electronics supply chain has recently rapidly expanded its manufacturing capacity, particularly for SiC and silicon devices, as ...
Nexperia releases 120V/4A half-bridge gate drivers - News
3 days ago · Nexperia has introduced a new series of high-performance gate driver ICs designed for driving both high-side and low-side N-channel MOSFETs in a synchronous buck or half-bridge configuration. The automotive-qualified NGD4300-Q100 is suitable for electronic power steering and power converters, while the NGD4300 has been designed for use with DC ...
Infineon unveils world’s thinnest silicon power wafer - News
Oct 29, 2024 · Infineon has announced a breakthrough in handling and processing the thinnest silicon power wafers, with a thickness of only 20µms and a diameter of 300mm, in a high-scale semiconductor fab. According to the company, this innovation will significantly help increase energy efficiency, power density and reliability in power conversion solutions ...
Mitsubishi 12-inch wafers target power modules - News
Sep 30, 2024 · Mitsubishi Electric has announced that its Power Device Works' Fukuyama Factory has begun large-scale supply of power semiconductor chips made from 12-inch silicon wafers for the assembly of semiconductor modules, effective immediately. The silicon power-semiconductor modules will initially be used in consumer products.
Mitsubishi announces six power modules for EVs - News
Jan 23, 2024 · Mitsubishi Electric has announced the release of six new J3-Series power semiconductor modules featuring either a SiC MOSFET or a RC-IGBT (Si), with compact designs and scalability for use in the inverters of electric vehicles (EVs) and plug-in hybrid electric vehicles (PHEVs). The new power modules will be exhibited at the 38th Electronics R&D ...
Power electronics market to reach $69.7B by 2030 - News
Apr 9, 2024 · UK-based Fairfield Market Research's latest report estimates that the global power electronics market will reach $69.7B by 2030, surging at a CAGR of 7.3 percent from 2023 to 2030.